'oversea_country' => 'e.g. Singapore, Japan, the United States',
'team_members' => 'Separate multiple names with commas',
'recommend' => 'Organization or referrer name',
'intro' => 'About 200 words',
'name' => 'Enter your full name',
'phone' => 'Enter an 11-digit mobile number',
'company' => 'Enter your organization',
'job' => 'Enter your job title',
'purpose' => 'Please select a purpose',
];
}
/**
* @return array<string,string>
*/
public static function helpEn(): array
{
return [
'location_province' => 'Required when “China” is selected',
'location_city' => 'City not required outside China',
'oversea_country' => 'Select “Outside China,” then enter the country',
'plan' => 'Include the company profile and positioning, core products/services, market size and competition situation, innovation barriers and differentiation, core team, and development strategy. PDF format; no more than 20 pages recommended.',
'supporting' => 'You may upload multiple files, including scanned copy of Business License; supporting documents for intellectual property rights (including patent certificates, trademark registration certificates, software copyright certificates, etc.); other supporting documents (including product or service introductions, award certificates, investment-financing certificates, etc.); qualification certificates such as academic credentials and degrees of founders or key principals. Maximum 20 MB per file. Supported: PDF, PPT, PPTX, DOC, DOCX, WPS, RAR, ZIP',
'commitment_accepted' => 'Open and read the full declaration, sign by hand at the end, and select “Confirm Signature.”',
public static function trackDescriptionsEn(): array
{
return [
'材料与芯片' => 'Original breakthroughs in optoelectronic new materials, optical chips and core components, covering indium phosphide, silicon photonics, lithium niobate processes, plus innovations in lasers, modulators, detector chips, supporting electronic chips and optical components.',
'器件与模块' => 'Breakthroughs in active/passive optical devices and high-speed modules, covering packaging-coupling, mass-production and device-level innovations for 400G/800G/1.6T, silicon-photonic and coherent modules.',
'场景与应用' => 'Scenarios such as computing-power networks, AI data centers, 5G/6G and industrial sensing, covering system integration, innovative applications and solutions for deep tech-industry alignment.',
'设备与服务' => 'Optical-communication manufacturing and testing, covering epitaxy, lithography, packaging-coupling equipment, testing instruments, packaging-test services and EDA-tool innovations.',